damascene

Plasma - induced damage on 90 nm Cu dual Damascene technology devices is investigated.

研究了等离子体工艺对90nm铜大马士革工艺器件的损伤.

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Cu electrodeposition is one of the most important technologies in the Damascene fabrication of interconnects.

铜电沉积是互连“大马士革”(Damascene)工艺中最为重要的技术之一.

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