reflow

Delamination caused by electrical - over - stress ( EOS ) and moisture expansion during reflow soldering have shown different delamination patterns.

由过电应力 ( EOS ) 和再流焊中的水汽膨胀引起的分层会显示出不同的失效模式.

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A potential reflow method - laser reflow soldering was expatiated in detail.

着重阐述了一种极具潜力的再流焊方法 ——— 激光再流焊.

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Good management for reflow and wave profile and profile board.

良好的管理为回流焊和波峰焊温度曲线及温度曲线量测板.

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Hand solder is recommended instead of reflow solder.

不建议使用回流焊,推荐使用手动焊接.

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Clear how to measuring reflow and wave profile.

清楚怎样测量回流焊和波峰焊温度曲线.

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The most obvious is the necessity for increased reflow temperature.

最明显的是,使用无铅锡膏必须提高回流焊温度.

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Suitable for flow and reflow soldering.

适合一般焊接及回焊.

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After reflow, carefully remove substrate with components and allow to cool.

回流后, 仔细拿开带组件的基板,并使之冷却.

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Adapted to the reflow soldering.

适应于回流焊接.

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The reflow process relies on the temperature profile setting.

回流过程依赖于温度曲线的设定.

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Compatible with infrared and vapor phase reflow solder process.

适用于回流焊接工艺.

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Do not inhale the vapor during reflow.

不要吸入回流焊时喷出的蒸气.

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Reflow solder paste in 2 hours as soon as possible after printing.

印刷后要在2小时内回流焊膏.

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Suitable for SMT craft reflow soldering.

适用于回流焊SMT工艺.

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Suit for reflow and wave flow solder.

适应再流焊与波峰焊.

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